This document gives a brief outline of the Institute of Integrated Micro and Nano Systems' equipment base. This equipment and the research staff are located in the Scottish Microelectronics Centre (SMC), a purpose built facility at the University's Science and Engineering campus at King's Buildings. The complex consists of approximately 250m2of class 10and 100m2of class 100 cleanrooms and 1000m2of office and laboratory space. £6M of new equipment has been procured and the table 1 below gives a brief summary of equipment availability.
Equipment Type SEM
|Furnaces(inc CVD Oxide/Nitride)||×||×||×||
|PECVD Oxide/ Nitride Deposition||×||×||×||×|
|Photoresist Coat and Develop Tracks||×||×||×||×|
|Double Sided Aligner (MEMS)||×||×||×||×|
|Wafer Stepper Optical Lithography||×||×||×||×|
|Deep Etch (MEMS)||×||×||×||×|
|Surface Treatm ent||×||×||×||×|
|Etch Release (critical point dryer)||×||×||*||*|
* Not available
If you would like to access some of these facilities or would like more details on the technologies available please contact Andrew Bunting (Andy.Bunting@ed.ac.uk), Anthony Walton (Anthony.Walton@ed.ac.uk), or some other member of the IMNS located in the Scottish Microelectronics Centre (SMC).
|Institute of Integrated Micro and Nano Systems|
|Scottish Microelectronics Centre|
|School of Engineering and Electronics|
|University of Edinburgh|
|EH9 3JF, UK|
|Tel:||0131 650 5610 (Direct dial)||(International +44 131 650 5622)|
|Fax:||0131 650 6554||(International +44 131 650 6554)|
|Tel:||0131 650 7474||Reception|
|email:||Andrew Bunting (Andy.Bunting@ed.ac.uk)|
Photograph of the SMC building. The cleanrooms are the housed in the low portion of the building. The offices and laboratories are located in the four storey portion with the second floor consisting of space for rental by external organisations.
The cleanrooms are located in the purpose build £4.2M ScottishMicroelectronics Centre building. This class 10 facility comprises 250 sq metres is controlled to 21±1°C with a relative humidity of 40±5% with a raised floor being used as the air return to the plenum.
The Laboratories maintains the following major items of processing equipment.
Balzers BAS450 coater system with two 5 in × 10 inch targets presently used for coating up to 24 × 3 inch wafer with Al/1%Si, Al,W and Ti. It is also capable of coating 4 and 6 inch wafers. Ion beam pre-cleaning is available using an Ion Tec Inc Kafmann source.
Oxford Plasmalab System 400 magnetron sputtering system capable of sputtering Al/1%Si, Al, W, Ta, Ti and TiN on 6 and 8 inch wafers. Ion beam pre-cleaning is also available.
Three quad stack Tempress Omega L furnaces, upgraded to direct digital control with supervisor computer. The systems are tooled for 3 inch wafers and support the following processes:
200mm tubes are available for oxidation, LPCVD silicon nitride (inc low stress) and polysilicon (inc low stress)
Fume extracted class 10 laminar flow chemical stations permit safe cleaning of furnace quartzware and the processing of 3 to 8 in wafers in industry standard cassettes through the stadard mineral acid cleaning and etching treatments.Wafers are finally dried in Fluoroware or Tempress rinser/driers. A Maragoni dryer is also available(3-8")
Photoresist coating, developing and baking are achieved on 3" a SVG 8600 track system and a CEE 75-200mm coater/develop system each comprising:
Mask aligning and exposure are carried out using contact printing or DSW (reduction projection printing) as appropriate. DSW printing is preferred for those chips greater than 6 mm square or those including geometries less than 3 microns. The machines in use are:
Contact printer : Cobilt 2020 soft contact (3")
Projection printer (double sided) : Karl Suss MA8/B8, (3, 4, 6 & 8") with IR alignment
Wafer Stepper: Optimetrix 8605, g-line, 0.32 NA, (3, 4 & 6")
Wafer Stepper: Nikon Body 9, i-line, 0.57 NA, (6 & 8")
Wafers are subject to visual inspection at all stages in processing using a variety of metallurgical microscopes from various manufacturers including Leitz, Reichart-Jung, Olympus etc
In addition, linewidth measurements on masks and wafers are made to ±0.2 microns using a Biorad Coincident Shear System. Completed devices and wafers may be subjected to SEM analysis using a Htachi 4500 or whole wafers on a Philips EE40FEG. Access to SEMs, FIB and an AFM is also available
Profiling of wafer topography is available using a Dektak Model 8000 surface profiler to record step height variations in the range 0.01 to 60 microns.
Refractive index and thickness of visually transparent dielectrics such as silicon dioxide and silicon nitride are measured using an Applied Materials Ellipsometer model AME500 and a Sopra SE-5 Spectroscopic ellipsometer. This method is particularly useful in the thickness range 0.005 to 0.2 microns. Thicker dielectric layers and polysilicon layers are more readily measured using the Nanoscope Model 010-180 reflectometer.
Sheet resistance of large area process layers is measured using a Veeco 1000 4 point probe.
A low volume capability for the assembly of chips into Flat Packs, TO5 and Dual In-line packages is available using the following equipment:
Where devices may suffer degradation during eutectic die attach, low temperature processing is available using doped epoxy. Ultrasonic wire bonding provides the additional flexibility required for infrequent hybrid assembly jobs.
Two HP4062C test systems with 48 switchable pins are connected to a Karl Suss 200mm PA200 automatic wafer prober with ProbeShield® EMC for low signal probing which can be used to perform measurements required by IC-CAP and other parameter extractors under software control. Similar measurements may also be made using HP4145 and HP 4156 semiconductor parameter analysers and CV measurements on other manual and semiautomatic probers.
The Facility uses Ultra 10 SPARC workstations running with the UNIX operating system to give multi-user access to the Synopsis process and device simulation packages. The following programs are available:
|TWB||Design of Experiments|
|SUPREM-3||1-D Process simulation|
|TSUPREM-4||2-D Process simulation|
|MEDICI||2-D Device simulation|
|DAVINCI||3-D Device simulation|
|TERRAIN||Etch and Deposition|
|MICHELANGELO||Gridder and data display|
|RS/1 Explore and Discover||Design of Experiments|
|Cornerstone||DOE and Statistical Analysis|
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