ICMTS12 TECHNICAL PROGRAM COMMITTEE
December 1, 2011
ALLEN, RICHARD
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
100 BUREAU DRIVE, STOP 8120
GAITHERSBURG, MD 20899-8120, USA
email: richard.allen@nist.gov
CHUNG, STEVE S.
DEPARTMENT OF ELECTRONIC ENGINEERING
NATIONAL CHIAO TUNG UNIVERSITY
1001 TA-HSUEH ROAD, HSINCHU 300
TAIWAN
email: schung@cc.nctu.edu.tw
CROS, ANTOINE
STMICROELECTRONICS
850 RUE JEAN MONET
38926 CROLLES CEDEX, FRANCE
email: antoine.cros@st.com
HABU, SATOSHI
AGILENT TECHNOLOGIES JAPAN, LTD.
9-1, TAKAKURA-CHO, HACHIOJI-SHI
TOKYO 192-8510, JAPAN
email: satoshi_habu@agilent.com
HAN, MICHAEL
QUALCOMM
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121-1714, USA
email: michael.han@qualcomm.com
HESS, CHRISTOPHER
PDF SOLUTIONS INC.
333 W. SAN CARLOS ST.
SUITE 700
SAN JOSE, CA 95110, USA
email: hess@pdf.com
JEPPSON, KJEL
CHALMERS UNIVERSITY OF TECHNOLOGY
DEPT. OF SOLID-STATE ELECTRONICS
S-412 96 GOTEBORG, SWEDEN
email: jeppson@chalmers.se
KANG, CHANG YONG
SEMATECH
2706 MONTOPOLIS DRIVE
AUSTIN, TEXAS 78741-6499, USA
email: chang.yong.kang@sematech.org
KLOOTWIJK, JOHAN
PHILIPS RESEARCH EUROPE
MICRO SYSTEMS & DEVICES GROUP
HIGH TECH CAMPUS 4
OFFICE WAG P.4.18 (WAG02)
5656 AE EINDHOVEN, THE NETHERLANDS
email: johan.klootwijk@philips.com
LEE, CHOONGHO
SAMSUNG ELECTRONICS CO., LTD
MEMORY DIVISION, SEMICONDUCTOR BUSINESS
SAN #24, NONGSEO-RI, GIHEUNG-EUP,
YONGIN-CITY, GYEONGGI-DO, 449-711, KOREA
email: choong.lee@samsung.com
LEE, HI-DEOK
DEPT. OF ELECTRONICS ENGINEERING
CHUNGNAM NATIONAL UNIV.
DAEJEON, 305-764, KOREA
email: hdlee@cnu.ac.kr
LINHOLM, LOREN
CONSULTANT
email: linhlw@comcast.net
LORA-TAMAYO, EMILIO
CENTRO NATIONAL DE MICROELECTRONICA
UNIVERSITAT AUTONOMA DE BARCELONA
E-08193 BELLATERRA,
BARCELONA, SPAIN
email: emilio.lora@imb-cnm.csic.es
MATHEWSON, ALAN
NMRC/ TYNDALE NATIONAL INSTITUTE
LEE MALTINGS
UNIVERSITY COLLEGE
CORK, IRELAND
email: Alan.Mathewson@tyndall.ie
MATSUI, HIROAKI
DEPARTMENT BIOENGINEERING & ELECTRONIC ENGINEERING
UNIVERSITY OF TOKYO
1-34-2, SENDAGI, BUNKYOU-KU
TOKYO 113-0022, JAPAN
email: hiroaki@ee.t.u-tokyo.ac.jp
MCANDREW, COLIN
FREESCALE
MD EL-317
2100 EAST ELLIOT ROAD
TEMPE, AZ 85284, USA
email: Colin.Mcandrew@freescale.com
MCCARTHY, KEVIN
DEPARTMENT OF ELECTRICAL AND ELECTRONIC ENGINEERING
UNIVERSITY COLLEGE CORK
CORK, IRELAND
email: k.mccarthy@ucc.ie
MITA, YOSHIO
DEPT. OF ELECTRICAL ENGINEERING
UNIVERSITY OF TOKYO
SHIBATA-MITA LABORATORY, BLDG. E10-490
2-11-16, YAYOI, BUNKYO-KU
TOKYO 113-8656, JAPAN
email: mita@ee.t.u-tokyo.ac.jp
OHGURO, TATSUYA
ADVANCED CMOS TECHNOLOGY DEPT.
SoC RES. & DEV. CENTER
TOSHIBA CORP. SEMICONDUCTOR COMPANY
8, SHINSUGITA-CHO, ISOGO-KU,
YOKOHAMA 235-8522, JAPAN
email: tatsuya.ooguro@toshiba.co.jp
IMEC
KAPELDREEF 75,
B3001 LEUVEN, BELGIUM
email: luigi.pantisano@imec.be
POULTER, MARK
TEXAS INSTRUMENTS
MS E155
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CA, 95052 USA
email: Mark.W.Poulter@ti.com
SCHMITZ, JURRIAAN
UNIVERSITY OF TWENTE
MESA+ INSTITUTE FOR NANOTECHNOLOGY
P.O. BOX 217
7500 AE ENSCHEDE
THE NETHERLANDS
email: J.Schmitz@utwente.nl
SCHRODER, DIETER
ARIZONA STATE UNIV.
DEPT OF ELECT ENG.
TEMPE, ARIZONA 85287-5706, USA
SEKITANI, TSUYOSHI
DEPARTMENT OF ELECTRICAL AND ELECTRONIC ENGINEERING
UNIVERSITY OF TOKYO
7-3-1 HONGO, BUNKYO-KU
TOKYO 113-8656, JAPAN
sekitani@ee.t.u-tokyo.ac.jp
SELMI, LUCA
DIEGM, UNIVERSITA DEGLI STUDI DI UDINE
VIA DELLE SCIENZE 208
33100 UDINE, ITALY
email: luca.selmi@uniud.it
SISCHKA, FRANZ
AGILENT HOME OFFICE
BIRKENSTR 2
D-71106 MAGSTADT,
GERMANY
email: franz.sischka@agilent.com
SMITH, BRAD
FREESCALE
7700 WEST PARMER LANE
MAILSTOP PL-34
AUSTIN, TEXAS 78729, USA
email: brad.smith@freescale.com
SMITH, STEWART
SCOTTISH MICROELECTRONICS CENTRE
SCHOOL OF ENGINEERING, THE KING’S BUILDINGS
UNIVERSITY OF EDINBURGH, EDINBURGH
EH9 3JF
UK
email: stewart.smith@ed.ac.uk
STAUFFER, LEE
KEITHLEY INSTRUMENTS, INC.
28775 AURORA RD.
CLEVELAND, OHIO 44139-1891, USA
email: lstauffer@keithley.com
TAKEUCHI, KIYSOHI
ADVANCED LSI DEVICES RESEARCH
RENESAS ELECTRONICS CORPORATION
1120 SHIMOKUZAWA, CHUOU-KU, SAGAMIHARA,
KANAGAWA 252-5298, JAPAN
email: kiyoshi.takeuchi.zn@renesas.com
TAMAKI, YOICHI
CONSORTIUM FOR ADVANCED SEMICONDUCTOR MATERIALS AND RELATED TECHNOLOGIES (CASMAT)
1-280, HIGASHI-KOIGAKUBO, KOKUBUNNJI-SHI
185-0014 TOKYO, JAPAN
email: tamakiy@casmat.or.jp
TERADA, KAZUO
FACULTY OF INFORMATION SCIENCES
HIROSHIMA CITY UNIVERSITY
3-4-1 OZUKA-HIGASHI, ASA-MINAMI-KU
HIROSHIMA, 731-3194, JAPAN
email: terada@info.hiroshima-cu.ac.jp
TOFFOLI, ALAIN
CEA/LETI - MINATEC - SILICON COMPONENT DIVISION
CHARACTERIZATION & ELECTRICAL TEST LABORAORY
17 RUE DES MARTYRS
F-38054
GRENOBLE CEDEX 9, FRANCE
email: alain.toffoli@cea.fr
TUINHOUT, HANS P.
NXP SEMICONDUCTORS
HIGH TECH CAMPUS 37
5656 AE EINDHOVEN
THE NETHERLANDS
email: hans.tuinhout@nxp.com
VERZI, BILL
AGILENT TECHNOLOGIES
11044 RESEARCH BLVD.
B-420
AUSTIN, TEXAS 78759, USA
email: bill_verzi@agilent.com
WALTON, ANTHONY J.
SCOTTISH MICROELECTRONICS CENTRE
INSTITUTE OF INTEGRATED MICRO AND NANO SYSTEMS
SCHOOL OF ENGINEERING
KINGS BUILDINGS
UNIVERSITY OF EDINBURGH
EDINBURGH
EH9 3JF
UK
email: Anthony.Walton@ed.ac.uk
WEILAND, LARG H.
PDF SOLUTIONS INC.
333 W. SAN CARLOS ST.
SUITE 700
SAN JOSE, CA 95110, USA
email: weiland@pdf.com
YERIC, GREG
ARM
3711 S. MOPAC EXPRESSWAY
BUILDING 1, SUITE 400
AUSTIN, TEXAS 78746, USA
email: Greg.Yeric@arm.com
_______________________________________________
OTHERS:
WALKER, WENDY
WIDERKHER AND ASSOCIATES
19803 LAUREL VALLEY PLACE
MONTGOMERY VILLAGE, MD 20886, USA
email: wwalker@widerkehr.com